ThermoSpot^® Benchtop Systems for IC Thermal Characterization

Using proprietary, robust refrigeration technology ThermoSpot can perform thermal cycling without the worry of cooling degradation so common with thermoelectric modules employed in competitive systems. Temptronic® temperature forcing systems provide efficient conductive cooling and heating without the need for thermoelectric modules. Its thermal head contains an interchangeable ThermoBridge™ that couples directly to your device under test with interfacing to in-circuit and test socketed DUTs.