Quickly and Easily Connect Thermal Caps to Temperature Forcing Systems
See the new quick-connect feature for adding a thermal enclosure to Temptronic ThermoStream® systems - nol tools or hardware needed.
The patent-pending, quick-connect feature will be available on all high capacity ThermoStream systems in November, 2015.
A temperature chamber capable of long dwell times and wide temperature ranges (-55 to 500°C) for Electro/Stress Migration, Time Dependent Dielectric Breakdown, and Hot Carrier / Vt Stability Tests.
How to set the bi-metal fail safe
Watch this video to learn how to set the primary over temperature fail safe on a thermal chamber. The chamber's primary fail safe is a bi-metal switch that protects the chamber from run-away or over temperature conditions. If an over temperature condition occurs, the bi-metal fail safe will trip and shut down the chamber's heating and cooling capabilities. It is factory set at 125°C and must be adjusted for the chamber to operate at temperatures above 125°C.
Thermal Plate integrates directly with vacuum bell jar for RF device testing
inTEST Thermal Solutions has designed a thermal cycling plate that integrates directly with a customer’s vacuum bell jar for space and altitude testing of RF modules, microwave components, and high power devices. The wide temperature range and stability of the plate is ideal for both thermal stressing of electronics and long periods of power supply testing.
Temperature Cycling Travelling Wave Tubes (TWTs)
inTEST Thermal Solutions (iTS) has designed a multi-zone thermal plate for hot/cold temperature cycling of microwave signal amplifiers used in satellite data communications. The heart of the amplifier is a travelling wave tube (TWT) and power supply.
How to replace the air filters in a Temptronic ThermoStream® temperature forcing system
Watch this video to learn how to change the air filters on a ThermoStream, mobile temperature forcing system. Order service kit CS158580, FILTER ELEMENT KIT, to perform this procedure.
Getting the most out of Thermal Chambers and Temperature Test Systems
Watch this video to learn how using a thermal system with temperature ranges beyond commercial and MIL-STD requirements can improve throughput when characterizing, conditioning, or testing electronics. A temperature environment that goes beyond requirements can speed up the transition time of the unit-under-test (UUT) and bring it to the target temperature much faster.
A video tutorial on automated cycling with a Temptronic ThermoStream® temperature forcing system
Watch this video to learn how to setup, save, and run temperature cycling profiles with the ThermoStream.
Improve Throughput for TXVR characterization and tuning
The rapid pace of transceiver design and high volume production demands high efficiency for characterization and tuning. Thermally, it means that devices must reach their programmed temperatures quickly. The ThermoStream® achieves this by creating a stable environment in seconds.
Saves cost of leak checking under new regulation
The environmentally friendly ECO series ThermoStream® temperature forcing systems will save users from additional maintenance costs under the EU F-Gas regulation for refrigeration systems...
Consumes less energy with high performance and quiet operation
An environmentally friendly series of Temptronic® ThermoStream® temperature forcing systems that use less energy and operate with very low audible noise have been introduced by inTEST Thermal Solutions. The ECO Series temperature test systems operate on...
Efficient cooling and heating even with high-Watt emitting devices
Two benchtop systems for thermal testing and characterization of integrated circuits including high-Watt emitting devices have been introduced by inTEST Thermal..
Two-zone plate provides thermal stress for satellite component
inTEST Thermal Solutions (iTS) has designed a multi-zone thermal plate for hot/cold temperature cycling of microwave signal amplifiers used in satellite data communications...
The integration of a temperature controlled thermal platform with the Agilent B1506A Power Device Analyzer has been introduced by inTEST Thermal Solutions and Agilent. The newly designed hot plate permits automated control of platform temperature, from enclosure ambient to 250°C, for characterization of power devices such as IGBTs and MOSFETs.
A redesigned website with temperature test and conditioning content for design and manufacturing engineers has been introduced by inTEST Thermal Solutions.