When to assess quality and reliability test resources
Thermal chambers have found a place in the psyche of test, quality, and production engineers - and for good reason. They can be an ideal test environment when precisely matched to the test specifications. However, often times they are not.
For high flow thermal conditioning of electronic modules
This bench top system is ideal for conditioning electronics with high volume, low pressure, temperature controlled air. The system delivers up to 43scfm of precisely controlled, clean dry air for conditioning components and instrumentation. It is capable of cycling and holding at temperatures from 20 to 70°C.
These thermal systems provide precision temperature control for MIL-AERO component characterization, testing, and production.
Materials testing often requires a long and narrow cavity to accommodate measurement devices. With tensile testing, objects are pulled in one direction and stressed until failure, but strain can also be used to pull the object in both directions. Customizing chambers for the OEM and end-user is what we do best.
This two-part article, was originally published in Sensors Magazine. In Part 2 we will discuss how cooling capacity and controls affect thermal performance. Part 1 addressed the variables in a test environment and the criteria for matching chamber size to the UUT (Unit Under Test).
This two-part article, originally published in Sensors Magazine, describes engineering considerations for specifying thermal environments to optimize production throughput of temperature-compensated sensors and transmitters. Part I covers chamber configurations, while Part 2 will address thermal environment performance related to heat transfer, uniformity, and controls.
Quickly and Easily Connect Thermal Caps to Temperature Forcing Systems
See the new quick-connect feature for adding a thermal enclosure to Temptronic ThermoStream® systems - nol tools or hardware needed.
The patent-pending, quick-connect feature will be available on all high capacity ThermoStream systems in November, 2015.
A temperature chamber capable of long dwell times and wide temperature ranges (-55 to 500°C) for Electro/Stress Migration, Time Dependent Dielectric Breakdown, and Hot Carrier / Vt Stability Tests.
Thermal Plate integrates directly with vacuum bell jar for RF device testing
inTEST Thermal Solutions has designed a thermal cycling plate that integrates directly with a customer’s vacuum bell jar for space and altitude testing of RF modules, microwave components, and high power devices. The wide temperature range and stability of the plate is ideal for both thermal stressing of electronics and long periods of power supply testing.
Temperature Cycling Travelling Wave Tubes (TWTs)
inTEST Thermal Solutions (iTS) has designed a multi-zone thermal plate for hot/cold temperature cycling of microwave signal amplifiers used in satellite data communications. The heart of the amplifier is a travelling wave tube (TWT) and power supply.
Improve Throughput for TXVR characterization and tuning
The rapid pace of transceiver design and high volume production demands high efficiency for characterization and tuning. Thermally, it means that devices must reach their programmed temperatures quickly. The ThermoStream® achieves this by creating a stable environment in seconds.