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temperature test & conditioning applications

March 2016

Reduce temperature cycling time, OFC and IMS 2016 Events

Sigma Systems - Chambers, Plates
Temptronic - Temperature Forcing
Thermonics - Process Chillers
ThermalTEST News
Updates on thermal testing
March 2016
In this issue
  • DUT Control: How to Reduce Time to Reach Temperature
  • OFC, Anaheim, demo of new temperature characterization system
  • Space Tech Expo and IMS 2016
DUT Control: How to Reduce
Time to Reach Temperature

Device under test (DUT) control is a unique algorithm designed to minimize test time by controlling your device temperature at set points, even during power cycling of the DUT. It directly monitors and controls device temperature and stabilizes the DUT to within 0.1°C.

DUT control is user selectable and customizable to match your thermal requirements based on mass, size, material, and heat dissipation.

Read the DUT Control Application Note here.   
ThermoSpot temperature testing system
ThermoSpot Temperature Test System
Join Us at the Optical Fiber Conference

On March 22-24, 2016, Anaheim, Booth 3463, we will demonstrate a new direct-contact temperature forcing system for testing optical components and other devices.
The Temptronic® ThermoSpot® bench top system consists of a highly responsive temperature forcing unit with a thermal probe designed to mate directly to the device under test. Direct contact of the thermal head to the optical device creates a highly efficient thermally conductive path to quickly induce temperatures to the device, even under power.
Two models span a temperature range from -65 to 180°C, providing a capacity to cool up to 55W at -55°C.

Visit Us at These Events

Space Tech Expo
May 24-26 Pasadena CA, Booth 3019
Learn about our electronics thermal conditioning with benchtop thermal test systems.
IMS 2016
May 23-26 San Francisco, CA Booth 2327
Learn about RF component stress testing with high-speed thermal platforms.

inTEST Thermal Solutions | 41 Hampden Rd. | Mansfield, MA 02048 | USA
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