Visit Us next week, March 5 thru 7, at The Optical Networking and Communication Conference & Exhibition (OFC2019) in San Diego, CA. We'll be at Booth #4714 with our ThermoSpot® Direct Contact Temperature Forcing System. Stop by and learn how the ThermoSpot can be used for thermal tuning and characterization of optical transceivers.
Visit Us next week, Oct. 23 to 25, at the Automotive Testing Expo in Novi, MI. We'll be at Booth #11034 with our thermal chambers, thermal plates and process chiller.
SATELLITE 2018 (March 12-15)
Walter E. Washington Convention Center, Washington, D.C
Join Us at Booth #644
Further your knowledge of thermal testing and process cooling for satellite communications and space technology. With forward-looking keynotes and in-depth conference sessions, this event explores the latest innovations and steps forward in building the future of connectivity.
OFC2018 (March 13-15)
San Diego Convention Center
Join Us at Booth #5916
Talk to us about transceiver temperature testing and optical component thermal characterization. The Optical Fiber Communication Conference and Exhibition (OFC) is the largest global conference and exhibition for the optical communications and networking industry. We will be exhibiting our Temptronic ThermoStream® and ThermoSpot® systems, and Sigma Systems thermal plates and thermal chambers
Saves cost of leak checking under new regulation
The environmentally friendly ECO series ThermoStream® temperature forcing systems will save users from additional maintenance costs under the EU F-Gas regulation for refrigeration systems...
Consumes less energy with high performance and quiet operation
An environmentally friendly series of Temptronic® ThermoStream® temperature forcing systems that use less energy and operate with very low audible noise have been introduced by inTEST Thermal Solutions. The ECO Series temperature test systems operate on...
Efficient cooling and heating even with high-Watt emitting devices
Two benchtop systems for thermal testing and characterization of integrated circuits including high-Watt emitting devices have been introduced by inTEST Thermal..
Two-zone plate provides thermal stress for satellite component
inTEST Thermal Solutions (iTS) has designed a multi-zone thermal plate for hot/cold temperature cycling of microwave signal amplifiers used in satellite data communications...
The integration of a temperature controlled thermal platform with the Agilent B1506A Power Device Analyzer has been introduced by inTEST Thermal Solutions and Agilent. The newly designed hot plate permits automated control of platform temperature, from enclosure ambient to 250°C, for characterization of power devices such as IGBTs and MOSFETs.
A redesigned website with temperature test and conditioning content for design and manufacturing engineers has been introduced by inTEST Thermal Solutions.
A temperature control system for high-temperature testing of ICs, transceivers, and PCBs has been introduced by inTEST Thermal Solutions. The Thermostream® ATS-750 delivers clean dry air from -90 to 300°C to support growing demands for testing electronics that need to operate at higher temperatures.
A replacement controller for Sigma Systems thermal chambers and plates has been introduced by inTEST Thermal Solutions. The TSR controller matches both size and programming syntax of legacy C3 and C4 controllers...
iTS has launched a comprehensive line of precision temperature forcing systems, the ATS-Series ThermoStream® systems. With temperature range extremes as high as +300ºC (570ºF) and as low as -100ºC (-148ºF), countless test and conditioning applications can now be solved with a compact, precise, and portable system.