ThermoSpot® Benchtop Systems for IC Thermal Characterization
Silicon Chip & Optical Component Temperature Testing; -65 to 175°C
Using proprietary, robust refrigeration technology ThermoSpot can perform thermal cycling without the worry of cooling degradation so common with thermoelectric modules employed in competitive systems. Temptronic® temperature forcing systems provide efficient conductive cooling and heating without the need for thermoelectric modules. Its thermal head contains an interchangeable ThermoBridge™ that couples directly to your device under test with interfacing to in-circuit and test socketed DUTs.