ThermoStream® Accessories
Enclosures to optimize your temperature environment
Selecting an enclosure that matches your device will provide the best performance for precise temperatures and rapid cycling.
A variety of standard enclosures attach directly to a ThermoStream nozzle or remotely via a hose. StreamChamber apertures reduce heat loss while allowing convenient access to devices.
If you don't see the size you need, contact us about custom enclosures.
Silicone mats provide sealing and insulation for test fixtures.
Hood Style ThermoHoodâ„¢
The Hood Style THERMOHOOD is a compact, extremely portable, chamber that is ideal for bringing components, assemblies, and other parts to temperature directly at the test site or benchtop.
Clamshell Style ThermoChamberâ„¢
Top-load (clamshell) style temperature chamber ideal for temperature test and conditioning of materials and components including: ICs, MEMS, and Optical Transceivers. Enables low temperature testing in a frost-free, thermal enclosure.
Front-Load Style ThermoChamberâ„¢
Front-load style test enclosure ideal for temperature test and conditioning of materials and components including: ICs, MEMS, and Optical Transceivers. Enables low temperature testing in a frost-free, uniform, thermal chamber.
T-Caps, Shrouds, and Mats
T-Caps, Shrouds, and Mats provide the best performance for precise temperatures and rapid cycling during temperature test and conditioning of materials and components including: ICs, MEMS, and Optical Transceivers. Enables low temperature testing in a frost-free, uniform, thermal chamber.
High Performance Air Dryer
Air Dryer for temperature forcing systems enables frost-free low temperature test and conditioning of materials and components including: ICs, MEMS, and Optical Transceivers.
ThermoSpot® DCP Series Stands & Accessories
The ThermoSpot bench top temperature forcing systems provide a precisely controlled, conductive thermal source for IC/Device Under Test (DUT) characterization, test, and failure analysis
Temptronic ThermoStream® Resources
Automated Thermal Testing of Power Devices
Designers can now characterize device behavior over wide temperature ranges using the HP289-PM thermal platform or ThermoStream air forcing system.
Temptronic mobile, high speed temperature environment
The rapid pace of component design and high volume production demands high efficiency for testing, characterization, and tuning.